High silicon-aluminum alloys(AlSi70) are regarded as a typical heat dissipation material for electronic packaging field.One of the key factor is that the Low CTE almost hardly varies with temperature,the feature is similar to the common semiconductor materials.Fig.shows AlSi70 alloy and pure silicon thermal expansion coefficient with the temperature changes. It is well known that the reason of thermal stress is due to the mismatch of thermal expansion between the components of the structure.Thus,the thermal stress in the package structure composed of silicon-aluminum alloy will not increase with the rising of temperature, but will decrease.This key point is obviously very advantageous to the encapsulation structure, which is different from the Kovar alloy.
Assembly one or a set of dies on the functional and protective chip base is another level of electronic packages.The chip base includes a single-chip base and a more complex multi-chip base that can contain multiple independent chips.The main aspects of electronic packages comprise:provide mechanical support for the microelectronic device and environmental protection, protection against harmful environmental impact on electronics, prevent partial high voltage, radio frequency signals and affect the surrounding electronic devices due to fever; Provide signal input and output channels for internal and external devices; Provide the current path for the sealing device; Provide heat dissipation access. Therefore,herein the article request electronic packaging material with low thermal expansion coefficient(CTE), low density, high thermal conductivity and good mechanical properties, at the same time must have good encapsulation process performance, and high reliability and low cost. Baienwei Co.,Ltd has successfully developed a binary of silicon-aluminum alloy which possess the combination properties for electronic packaging.
Baienwei Co.,Ltd fabricates series of silion-aluminum alloy materials which the primary silicon particles with an average size of 10μm and distribution well.Due to the uniform and homogeneous silicon particle,any direction of the Si-Al alloy has the outstanding mechanical and thermal properties,essentiall the separation between the electronic parts and the packaging materials is eliminated by the deformation or warping of the electronic parts caused by higher heat or mechanical loading.With the refined silicon particles,the AlSi alloys is ease of machined by diamond tools,PCD tools or carbide-tipped tool,and will not leave too much processing stress.The binary silicon-aluminum(AlSi) alloys has become an versatile thermal management material of replacement Cu-M,Cu-Mo,Kovar and Titanium.
It is well known that renowned Sandvik Osprey Metals Ltd(British) has developed a family of silicon-aluminum(also named CE) alloys produced by the spray forming technology for electronic housing or packages field. By comparation,Baienwei Co.,Ltd AlSi alloys mechanical performance(e.g.Tensile Strength,Bend Strength and Fracture toughness) have an efficiency greater than 15~20% under the equal conditions of same heat conduction,low thermal expansion coefficients,density.These excellent properties can attribute to the refined primary silicon particles and grain’s uniform and isotropic.
Applications of Si-30%Al controlled expansion alloy:
(1) High-brightness LED
(2) Photovoltaic(PV) Cells
Wafer Manufacturing Process:
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