Tianjin Baienwei New Material Technology Co.,Ltd has developed a new family of lightweight, low expansion aluminium‐silicon alloys to suit electronic applications, containing between 30 and 80 wt.% aluminium. They are produced using the Rapid Solidification process, which achieves homogeneous and isotropic properties. Their advantageous physical characteristics, combining low thermal expansion, high thermal conductivity and low density are particularly suited for packaging electronic circuitry. These controlled expansion alloys are easy to machine to tight tolerances using standard machine tools and they can be electroplated with gold, silver or nickel finishes without difficulty.
The key benefits of controlled expansion alloy(AlSi27~AlSi80),
■The controlable low thermal expansion coefficients(CTE) in the range of 7~17ppm/℃;
■ Ease of machined,controlled expansion alloy(AlSi) can be tailored to all sizes and shape;
■Common electroplating process,ease of soldering,such as Arc Welding,laser welding and electron beam welding process;
■ Relative density which could be reach up to 100%;
■ Possess lower weight and effective cost;
■The microstructure shows a uniform and isotropic,no porosity and holes;
■ Higher strength and specific stiffness eminently suitable for a wide range of applications;
■ Excellent EMI/RFI shielding performance;
■ Environmentally friendly,present no disposal problems.