Baienwei company's Si/Al alloys are in growing demand for a variety of applications in electronics and allied industries. These alloys are available in the composition range 87% Si-13% Al to 12 %Si-88 %Al, which enables the coefficient of thermal expansion(CTE) to be adjusted between 2.0 and 20 ppm/K,so as to be compatible with many common microelectronic devices, substrates, and solid-state laser materials.
These alloys are typically between three and six times lighter than established packaging and baseplate materials used in RF and microwave products, such as Kovar, copper-molybdenum(Cu-Mo) and copper-tungsten(Cu-W). At the same time, the AlSi Alloys offer greatly superior thermal conductivity compared to Kovar a vital requirement for meeting the increased power loading requirements of the latest generation of devices and associated circuitry. They possess high specific stiffness, but are not unduly hard, and so are amenable to standard machining operations, such as milling and drilling, and are as easy to machine by EDM.The Al-Si Alloys are readily platable, using industry proven methods. Being composed of Si and Al, the alloys are environmentally friendly, safe to handle and use, and present no disposal problems. As they do not contain strategic metals, such as cobalt (Co), tungsten (W), or molybdenum (Mo), Al-Si Alloys are far less susceptible to price volatility and supply shortages.
The using of silicon/aluminum (Si/Al) alloys produced by rapid solidified process in our company that can have their CTE altered easily to match the CTE of whatever crystal material is chosen and still have a thermal transfer coefficient suitable for large heat transfer. The material in a flow boil-off cryogenic cooling system that tested,it shows the AlSi80(80Si/20Al) alloy material is capable of heat transfer of 21.5KW/m2K , with cold plate temperatures below 110 K.
● Good machinability;
● Higher specific stiffness;
● Lower weight;
● Superior CTE is matched over a wide temperature ranges.